PMV185XN 30 v, single n-channel trench mosfet 3 august 2012 product data sheet 1. product profile 1.1 general description n-channel enhancement mode field-effect transistor (fet) in a small sot23 (to-236ab) surface-mounted device (smd) plastic package using trench mosfet technology. 1.2 features and benefits ? low r dson ? very fast switching ? trench mosfet technology 1.3 applications ? relay driver ? high-speed line driver ? low-side loadswitch ? switching circuits 1.4 quick reference data table 1. quick reference data symbol parameter conditions min typ max unit v ds drain-source voltage - - 30 v v gs gate-source voltage t amb = 25 c -12 - 12 v i d drain current v gs = 4.5 v; t amb = 25 c; t 5 s [1] - - 1.2 a static characteristics r dson drain-source on-state resistance v gs = 4.5 v; i d = 1.1 a; t j = 25 c - 185 250 m [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated, mounting pad for drain 6 cm 2 . product specification sales@twtysemi.com 1 of 4 http://www.twtysemi.com
PMV185XN 30 v, single n-channel trench mosfet 2. pinning information table 2. pinning information pin symbol description simplified outline graphic symbol 1 g gate 2 s source 3 d drain 1 2 3 to-236ab (sot23) s d g 017aaa253 3. ordering information table 3. ordering information package type number name description version PMV185XN to-236ab plastic surface-mounted package; 3 leads sot23 4. marking table 4. marking codes type number marking code [1] PMV185XN eh% [1] % = placeholder for manufacturing site code 5. limiting values table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v ds drain-source voltage - 30 v v gs gate-source voltage t amb = 25 c -12 12 v v gs = 4.5 v; t amb = 25 c; t 5 s [1] - 1.2 a v gs = 4.5 v; t amb = 25 c [1] - 1.1 a i d drain current v gs = 4.5 v; t amb = 100 c [1] - 0.7 a i dm peak drain current t amb = 25 c; single pulse; t p 10 s - 4.4 a [2] - 325 mw t amb = 25 c [1] - 455 mw p tot total power dissipation t sp = 25 c - 1275 mw product specification sales@twtysemi.com 2 of 4 http://www.twtysemi.com
PMV185XN 30 v, single n-channel trench mosfet symbol parameter conditions min max unit t j junction temperature -55 150 c t amb ambient temperature -55 150 c t stg storage temperature -65 150 c source-drain diode i s source current t amb = 25 c [1] - 0.7 a [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated, mounting pad for drain 6 cm 2 . [2] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. 6. thermal characteristics table 6. thermal characteristics symbol parameter conditions min typ max unit [1] - 333 385 k/w in free air [2] - 240 275 k/w r th(j-a) thermal resistance from junction to ambient in free air; t 5 s [2] - 203 235 k/w r th(j-sp) thermal resistance from junction to solder point - 85 100 k/w [1] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. [2] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for drain 6 cm 2 . product specification sales@twtysemi.com 3 of 4 http://www.twtysemi.com
PMV185XN 30 v, single n-channel trench mosfet symbol parameter conditions min typ max unit v gs = 12 v; v ds = 0 v; t j = 25 c - - 100 na i gss gate leakage current v gs = -12 v; v ds = 0 v; t j = 25 c - - 100 na v gs = 4.5 v; i d = 1.1 a; t j = 25 c - 185 250 m v gs = 4.5 v; i d = 1.1 a; t j = 150 c - 300 400 m r dson drain-source on-state resistance v gs = 2.5 v; i d = 0.25 a; t j = 25 c - 255 365 m g fs forward transconductance v ds = 10 v; i d = 1.1 a; t j = 25 c - 2.9 - s dynamic characteristics q g(tot) total gate charge - 0.87 1.3 nc q gs gate-source charge - 0.17 - nc q gd gate-drain charge v ds = 15 v; i d = 1.1 a; v gs = 4.5 v; t j = 25 c - 0.24 - nc c iss input capacitance - 76 - pf c oss output capacitance - 30 - pf c rss reverse transfer capacitance v ds = 15 v; f = 1 mhz; v gs = 0 v; t j = 25 c - 22 - pf t d(on) turn-on delay time - 7 - ns t r rise time - 11 - ns t d(off) turn-off delay time - 16 - ns t f fall time v ds = 15 v; i d = 1.1 a; v gs = 4.5 v; r g(ext) = 6 ; t j = 25 c - 7 - ns source-drain diode v sd source-drain voltage i s = 0.7 a; v gs = 0 v; t j = 25 c - 0.8 1.2 v product specification sales@twtysemi.com 4 of 4 http://www.twtysemi.com
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